- Manufacturer：
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- BOYD (1)
- Usage：
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- Shape：
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- Thermal Conductivity：
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- Backing, Carrier：
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4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Shiu Li Technology | 1 |
25
In-stock
|
Get Quote | |||
|
|
Laird - Performance Materials | 1 |
189
In-stock
|
Get Quote | |||
|
|
Shiu Li Technology | 1 |
41
In-stock
|
Get Quote | |||
|
|
BOYD | 3,000 | Get Quote |
