- Manufacturer：
-
- BOYD (1)
- Comair Rotron (1)
- CUI Devices (2)
- Product Status：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | 1 |
19,240
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
2,400
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1,000 | Get Quote | ||||
|
|
Comair Rotron | 1 | Get Quote |
