- Manufacturer：
-
- BOYD (4)
- CUI Devices (3)
- Length：
-
- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | 1 |
1,469
In-stock
|
Get Quote | |||
|
|
BOYD | 10,000 | Get Quote | ||||
|
|
CUI Devices | 5,000 | Get Quote | ||||
|
|
BOYD | 10,000 | Get Quote | ||||
|
|
CUI Devices | 5,000 | Get Quote | ||||
|
|
BOYD | 12,000 | Get Quote | ||||
|
|
CUI Devices | 5,000 | Get Quote |
