- Manufacturer：
-
- BOYD (7)
- Comair Rotron (1)
- CUI Devices (1)
- Ohmite (9)
- Product Status：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
20 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | 1 |
6,180
In-stock
|
Get Quote | |||
|
|
Ohmite | 1 |
35,550
In-stock
|
Get Quote | |||
|
|
Ohmite | 1 |
20,698
In-stock
|
Get Quote | |||
|
|
Wakefield Thermal | 1 |
310
In-stock
|
Get Quote | |||
|
|
Ohmite | 1 | Get Quote | ||||
|
|
Wakefield Thermal | 1 | Get Quote | ||||
|
|
BOYD | 1 |
7,911
In-stock
|
Get Quote | |||
|
|
CUI Devices | 9,000 | Get Quote | ||||
|
|
BOYD | 1,000 | Get Quote | ||||
|
|
BOYD | 1,000 | Get Quote | ||||
|
|
BOYD | 2,000 | Get Quote | ||||
|
|
BOYD | 1,000 | Get Quote | ||||
|
|
Ohmite | 1 | Get Quote | ||||
|
|
Ohmite | 1 | Get Quote | ||||
|
|
Comair Rotron | 1 | Get Quote | ||||
|
|
BOYD | 1,568 | Get Quote | ||||
|
|
Ohmite | 1 | Get Quote | ||||
|
|
BOYD | 1 | Get Quote | ||||
|
|
Ohmite | 1 | Get Quote | ||||
|
|
Ohmite | 1 | Get Quote |
