- Manufacturer：
-
- CTS Corporation (1)
- CUI Devices (1)
- Type：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
2 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1,500 | Get Quote | ||||
|
|
CTS Corporation | 300 | Get Quote |
