- Manufacturer:
-
- BOYD (1)
- CTS Corporation (1)
- Product Status:
-
- Length:
-
- Material:
-
- Width:
-
- Attachment Method:
-
- Package Cooled:
-
- Fin Height:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Material Finish:
-
9 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | 1 |
12,172
In-stock
|
Get Quote | |||
|
Advanced Thermal Solutions, Inc. | 1 |
728
In-stock
|
Get Quote | |||
|
ASSMANN WSW Components | 1 |
19,081
In-stock
|
Get Quote | |||
|
ASSMANN WSW Components | 1 |
1,311
In-stock
|
Get Quote | |||
|
Advanced Thermal Solutions, Inc. | 1 |
548
In-stock
|
Get Quote | |||
|
ASSMANN WSW Components | 1 |
79
In-stock
|
Get Quote | |||
|
NTE Electronics, Inc. | 1 |
384
In-stock
|
Get Quote | |||
|
Advanced Thermal Solutions, Inc. | 1 | Get Quote | ||||
|
CTS Corporation | 1 | Get Quote |
