- Manufacturer：
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- BOYD (2)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | 1 |
9,203
In-stock
|
Get Quote | |||
|
|
Wakefield Thermal | 1 |
430
In-stock
|
Get Quote | |||
|
|
Wakefield Thermal | 1 |
32
In-stock
|
Get Quote | |||
|
|
BOYD | 1,500 | Get Quote |
