- Manufacturer：
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- CUI Devices (1)
- Material：
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- Attachment Method：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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2 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1 |
1,885
In-stock
|
Get Quote | |||
|
|
Wakefield Thermal | 1 |
31,128
In-stock
|
Get Quote |
