- Manufacturer：
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- CTS Corporation (1)
- CUI Devices (2)
- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1,200 | Get Quote | ||||
|
|
CUI Devices | 1,350 | Get Quote | ||||
|
|
CTS Corporation | 300 | Get Quote |
