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Fans, Thermal Management
Thermal
Heat Sinks
Type:
Board Level
(1)
Board Level, Vertical
(1)
Attachment Method:
Bolt On
(1)
Bolt On and PC Pin
(1)
Package Cooled:
TO-218
(1)
TO-220
(1)
Thermal Resistance @ Forced Air Flow:
2.00°C/W @ 300 LFM
(1)
2.50°C/W @ 200 LFM
(1)
Filter:
Heat Sinks
Power Dissipation @ Temperature Rise : 16.0W @ 50°C
2 Records
Image
Part
Manufacturer
Description
MOQ
Stock
Action
530001B00000
BOYD
BOARD LEVEL HEAT SINK
1
PDF
Get Quote
533602B02500G
BOYD
BOARD LEVEL HEAT SINK
1
PDF
Get Quote
530001B00000
BOYD
BOARD LEVEL HEAT SINK
Stock : 0
RFQ
533602B02500G
BOYD
BOARD LEVEL HEAT SINK
Stock : 0
RFQ
1 / 1 Page, 2 Records
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