- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
3 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1 |
72
In-stock
|
Get Quote | |||
|
|
CUI Devices | 5,000 | Get Quote | ||||
|
|
CUI Devices | 9,000 | Get Quote |
