- Manufacturer：
-
- BOYD (3)
- Comair Rotron (1)
- CTS Corporation (2)
- CUI Devices (2)
- Product Status：
-
- Length：
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- Material：
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- Width：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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11 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | 1 |
7,871
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
67
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
11,028
In-stock
|
Get Quote | |||
|
|
ASSMANN WSW Components | 1 |
9,840
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
3,036
In-stock
|
Get Quote | |||
|
|
NTE Electronics, Inc. | 1 |
222
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions, Inc. | 1 | Get Quote | ||||
|
|
CUI Devices | 4,000 | Get Quote | ||||
|
|
Comair Rotron | 1 | Get Quote | ||||
|
|
CTS Corporation | 1 | Get Quote | ||||
|
|
CTS Corporation | 1 | Get Quote |
