- Manufacturer：
-
- Adafruit (1)
- BOYD (1)
- CUI Devices (2)
- Length：
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- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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15 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
T-Global Technology | 1 |
289
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
1,072
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
5,664
In-stock
|
Get Quote | |||
|
|
Adafruit | 1 |
538
In-stock
|
Get Quote | |||
|
|
ASSMANN WSW Components | 1 |
48,823
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
2,325
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
19
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
46
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
233
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
4
In-stock
|
Get Quote | |||
|
|
Wakefield Thermal | 500 | Get Quote | ||||
|
|
ASSMANN WSW Components | 2,400 | Get Quote | ||||
|
|
Wakefield Thermal | 500 | Get Quote | ||||
|
|
Wakefield Thermal | 500 | Get Quote | ||||
|
|
Wakefield Thermal | 500 | Get Quote |
