- Manufacturer：
-
- BOYD (3)
- CTS Corporation (2)
- CUI Devices (1)
- Product Status：
-
- Material：
-
- Diameter：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
-
6 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1 |
1,922
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
6,048
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
2,206
In-stock
|
Get Quote | |||
|
|
BOYD | 5,000 | Get Quote | ||||
|
|
CTS Corporation | 1 | Get Quote | ||||
|
|
CTS Corporation | 1 | Get Quote |
