- Manufacturer：
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- CUI Devices (1)
- Ohmite (1)
- Product Status：
-
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
T-Global Technology | 1 |
903
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
131
In-stock
|
Get Quote | |||
|
|
ASSMANN WSW Components | 1 |
8,390
In-stock
|
Get Quote | |||
|
|
ASSMANN WSW Components | 1 | Get Quote | ||||
|
|
T-Global Technology | 1 | Get Quote | ||||
|
|
T-Global Technology | 1 | Get Quote | ||||
|
|
T-Global Technology | 1 | Get Quote | ||||
|
|
Ohmite | 1 | Get Quote |
