- Manufacturer：
-
- AMEC Thermasol (1)
- BOYD (1)
- CUI Devices (3)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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11 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
T-Global Technology | 1 |
112
In-stock
|
Get Quote | |||
|
|
T-Global Technology | 1 |
171
In-stock
|
Get Quote | |||
|
|
T-Global Technology | 1 |
74
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
2,986
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
1,931
In-stock
|
Get Quote | |||
|
|
T-Global Technology | 1 |
10
In-stock
|
Get Quote | |||
|
|
T-Global Technology | 1 |
67
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
702
In-stock
|
Get Quote | |||
|
|
T-Global Technology | 1 |
2
In-stock
|
Get Quote | |||
|
|
AMEC Thermasol | 10 |
682
In-stock
|
Get Quote | |||
|
|
CUI Devices | 6,750 | Get Quote |
