- Manufacturer：
-
- AMEC Thermasol (1)
- BOYD (1)
- Cooling Source (2)
- CUI Devices (2)
- Sarnikon (4)
- T-Global Technology (14)
- Product Status：
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- Shape：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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31 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | 1 |
1,223
In-stock
|
Get Quote | |||
|
|
ASSMANN WSW Components | 1 |
2,271
In-stock
|
Get Quote | |||
|
|
T-Global Technology | 1 |
362
In-stock
|
Get Quote | |||
|
|
T-Global Technology | 1 |
911
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
1,377
In-stock
|
Get Quote | |||
|
|
T-Global Technology | 1 |
131
In-stock
|
Get Quote | |||
|
|
ASSMANN WSW Components | 1 | Get Quote | ||||
|
|
ASSMANN WSW Components | 1 |
484
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
751
In-stock
|
Get Quote | |||
|
|
T-Global Technology | 1 |
589
In-stock
|
Get Quote | |||
|
|
T-Global Technology | 1 | Get Quote | ||||
|
|
T-Global Technology | 1 | Get Quote | ||||
|
|
T-Global Technology | 1 |
654
In-stock
|
Get Quote | |||
|
|
T-Global Technology | 1 | Get Quote | ||||
|
|
T-Global Technology | 1 |
14
In-stock
|
Get Quote | |||
|
|
ASSMANN WSW Components | 1 | Get Quote | ||||
|
|
T-Global Technology | 1,000 | Get Quote | ||||
|
|
CUI Devices | 8,000 | Get Quote | ||||
|
|
Sarnikon | 100 |
500
In-stock
|
Get Quote | |||
|
|
Sarnikon | 150 |
500
In-stock
|
Get Quote |
