- Manufacturer：
-
- BOYD (28)
- Comair Rotron (2)
- CTS Corporation (1)
- CUI Devices (14)
- Ohmite (3)
- Wakefield Thermal (22)
- Product Status：
-
- Material：
-
- Width：
-
- Diameter：
-
- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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75 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | 1 |
3,092
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions, Inc. | 1 |
5,453
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
3,435
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
5,930
In-stock
|
Get Quote | |||
|
|
Wakefield Thermal | 1 |
12,241
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
7,877
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
3,648
In-stock
|
Get Quote | |||
|
|
Wakefield Thermal | 1 |
3,913
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
5,033
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
4,700
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
24,740
In-stock
|
Get Quote | |||
|
|
Wakefield Thermal | 1 |
5,867
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
7,362
In-stock
|
Get Quote | |||
|
|
Wakefield Thermal | 1 |
5,355
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
18,972
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
5,467
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
719
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
2,537
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
1,147
In-stock
|
Get Quote | |||
|
|
CUI Devices | 1 |
1,329
In-stock
|
Get Quote |
