- Manufacturer：
-
- BOYD (7)
- Comair Rotron (3)
- CTS Corporation (2)
- CUI Devices (2)
- Product Status：
-
- Material：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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19 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | 1 |
1,721
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
2,490
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
3,971
In-stock
|
Get Quote | |||
|
|
Wakefield Thermal | 1 |
2,052
In-stock
|
Get Quote | |||
|
|
Wakefield Thermal | 1 |
31,128
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
23,710
In-stock
|
Get Quote | |||
|
|
BOYD | 1 |
7,521
In-stock
|
Get Quote | |||
|
|
ASSMANN WSW Components | 1 |
449
In-stock
|
Get Quote | |||
|
|
Advanced Thermal Solutions, Inc. | 1 | Get Quote | ||||
|
|
Comair Rotron | 1 | Get Quote | ||||
|
|
Comair Rotron | 1 | Get Quote | ||||
|
|
CUI Devices | 4,000 | Get Quote | ||||
|
|
CUI Devices | 4,000 | Get Quote | ||||
|
|
Comair Rotron | 1 | Get Quote | ||||
|
|
CTS Corporation | 1 | Get Quote | ||||
|
|
BOYD | 2,000 | Get Quote | ||||
|
|
CTS Corporation | 1 | Get Quote | ||||
|
|
BOYD | 2,000 | Get Quote | ||||
|
|
BOYD | 1 | Get Quote |
