Thermal - Radomey 과학기술유한공사

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469 Records

Part	Manufacturer	Description	MOQ		Stock	Action
HSB12-272706	CUI Devices	HEAT SINK, BGA, 27 X 27 X 6 MM	1	PDF	1,426 In-stock	Get Quote
HSS10-B20-P40	CUI Devices	HEAT SINK, STAMPING, TO-220, 29.	1	PDF	1,741 In-stock	Get Quote
HSS24-B20-NP	CUI Devices	HEAT SINK, STAMPING, TO-218/TO-2	1	PDF	2,962 In-stock	Get Quote
HSS-B20-065V-02	CUI Devices	HEATSINK TO-220 2.9W ALUMINUM	1	PDF	1,745 In-stock	Get Quote
HSE-B20350-NP	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 35	1	PDF	1,055 In-stock	Get Quote
HSB18-232310	CUI Devices	HEAT SINK, BGA, 23 X 23 X 10 MM	1	PDF	5,367 In-stock	Get Quote
HSS13-B20-NP	CUI Devices	HEAT SINK, STAMPING, TO-220, 31	1	PDF	1,885 In-stock	Get Quote
HSS-B20-061H	CUI Devices	HEATSINK TO-220 4W ALUMINUM	1	PDF	2,115 In-stock	Get Quote
HSB26-343408	CUI Devices	HEAT SINK, BGA, 33.5 X 33.5 X 8	1	PDF	1,072 In-stock	Get Quote
HSS03-B20-P318	CUI Devices	HEAT SINK, STAMPING, TO-220, 41.	1	PDF	1,922 In-stock	Get Quote
HSS02-B20-P318	CUI Devices	HEAT SINK, STAMPING, TO-220, 23.	1	PDF	1,548 In-stock	Get Quote
HSE-B250-04H	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	1	PDF	1,408 In-stock	Get Quote
HSB23-232325	CUI Devices	HEAT SINK, BGA, 23 X 23 X 25 MM	1	PDF	1,035 In-stock	Get Quote
HSS01-B20-CP	CUI Devices	HEAT SINK, STAMPING, TO-220, 49.	1	PDF	1,141 In-stock	Get Quote
HSB20-353525	CUI Devices	HEAT SINK, BGA, 35 X 35 X 25 MM	1	PDF	502 In-stock	Get Quote
HSB21-454515	CUI Devices	HEAT SINK, BGA, 45 X 45 X 15 MM	1	PDF		Get Quote
HSB14-353518	CUI Devices	HEAT SINK, BGA, 35 X 35 X 18 MM	1	PDF	976 In-stock	Get Quote
HSB19-272718	CUI Devices	HEAT SINK, BGA, 27 X 27 X 18 MM	1	PDF	259 In-stock	Get Quote
HSB17-404025	CUI Devices	HEAT SINK, BGA, 40 X 40 X 25 MM	1	PDF	976 In-stock	Get Quote
HSB16-404018	CUI Devices	HEAT SINK, BGA, 40 X 40 X 18 MM	1	PDF	1,505 In-stock	Get Quote

1 / 24 Page, 469 Records

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