Manufacturer:
Cooling Type:
RS-232 (422, 485):
Number of Cores:
RAM Capacity/Installed:
Image Part Manufacturer Description MOQ Stock Action
IP419 iBASE Technology
CB, FOR COM EXPRESS (TYPE 6), AL
1 Get Quote
MI998EF iBASE Technology
ITX, LGA1151 CORE I7/I5/I3, PENT
1 Get Quote
MI998AFE iBASE Technology
ITX, LGA1151 CORE I7/I5/I3, PENT
1 Get Quote
MI998AF iBASE Technology
ITX, LGA1151 CORE I7/I5/I3, PENT
1 Get Quote
MI998AFE-C246 iBASE Technology
ITX, LGA1151 XEON E , CORE I7/I5
1 Get Quote
MI998EFE iBASE Technology
ITX, LGA1151 CORE I7/I5/I3, PENT
1 Get Quote
MI979BF-217 iBASE Technology
ITX, AMD GX217GI APU (1.7GHZ/2.0
1 Get Quote
MI979BF-217D iBASE Technology
ITX, AMD GX217GI APU (1.7GHZ/2.0
1 Get Quote
MI990VF-X28E iBASE Technology
ITX, INTEL XEON E3-1505M V5 (2.8
1 Get Quote
MI979MF-421 iBASE Technology
ITX, AMD RX421BD APU (2.1GHZ/3.4
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MI979MF-421D iBASE Technology
ITX, AMD RX421BD APU (2.1GHZ/3.4
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MI988F-1202 iBASE Technology
ITX, AMD RYZEN V1202B DC APU (2.
1 Get Quote
MI990EF-6100E iBASE Technology
ITX, INTEL CORE I3-6100E(2.7GHZ)
1 Get Quote
MI988F-1756 iBASE Technology
ITX, AMD RYZEN V1756B QC APU (3.
1 Get Quote
2I110AW-EI7 LEX System
2.5" SBC W/CPU HEATSINK
1
8
In-stock
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2I110D-EI7 LEX System
2.5" SBC W/CPU HEATSINK
1
8
In-stock
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MI988F-1807 iBASE Technology
ITX, AMD RYZEN V1807B QC APU (3.
1 Get Quote
2I640DW-J12 LEX System
2.5" SBC W/CPU HEATSINK
1
8
In-stock
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2I640DW-E13 LEX System
2.5" SBC W/CPU HEATSINK
1
8
In-stock
Get Quote
2I640CW-J12 LEX System
2.5" SBC W/CPU HEATSINK
1
8
In-stock
Get Quote
1 / 2 Page, 25 Records